| 摘要 |
PROBLEM TO BE SOLVED: To prevent dust from entering a mini-environment type semiconductor manufacturing apparatus from an entrance exit of a wafer of FOUP and an opening of a loading section. SOLUTION: At an inner peripheral surface portion of the opening 18 of the loading section 4, a cleaning air blow-off device 30 is installed which has a rectangular filter 34 formed connecting cylindrical filter mediums 33 in a rectangular frame shape, disposed in a filter storage case 32 in a rectangular frame shape, and an air curtain is formed by blowing cleaning air 42 from a blow-off portion 29 comprising many bored small air vent holes 40 to an outer surface portion 32a and an inner peripheral surface portion 32b of the filter storage case 32 constituting the cleaning air blow-off device 30 at a uniform air speed along the entrance exit 9 of the FOUP 6 and the opening 18 of the loading section 4, thereby preventing outside air containing dust 27 from entering the FOUP 6 and a cleaning space in the semiconductor manufacturing apparatus 1 when a lid 10 of the FOUP 6 is opened. COPYRIGHT: (C)2009,JPO&INPIT
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