发明名称 FILM-FORMING COMPOSITION, INSULATING FILM AND ELECTRONIC DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a film-forming composition (coating liquid) capable of forming an insulating film having a low permittivity and excellent mechanical strengths and having good surface properties, to provide an insulating film obtained by using the film-forming composition, and to provide an electronic device having the insulating film. SOLUTION: The film-forming composition comprises (A) a polymer that comprises a monomer unit represented by formula (1) and has a weight average of≥1,500 mol.wt. In the formula (1), X is O, S or CH<SB>2</SB>; R is alkyl, alkenyl, alkynyl, aryl, alkoxy, acyloxy, aryloxy, hydroxyl, carboxyl, alkoxycarbonyl, aryloxycarbonyl, halogen, trialkylsilyl or triarylsilyl, and R further may have a substituent and may form a ring structure by combining mutually; and n is an integer of 0-4. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009215365(A) 申请公布日期 2009.09.24
申请号 JP20080057929 申请日期 2008.03.07
申请人 FUJIFILM CORP 发明人 IWATO KAORU;INABE HARUKI
分类号 C08L45/00;C08F38/00;C08L49/00;H01L21/312;H01L21/768;H01L23/522 主分类号 C08L45/00
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