| 摘要 |
Disclosed is a chip scale package tray. The chip scale package tray includes: a rectangular frame 10; a plurality of seat members 20 formed from a material relatively soft and superior in frictional force as compared to the frame 10, the seat members 20 being arranged on the top of the frame 10 in a grid pattern, a semiconductor chip being loaded on the top of each of the seat members 20; and a plurality of support members 30 formed from a material relatively soft and superior in frictional force as compared to the frame 10, the support members 30 being attached to the bottom of the frame 10 to be opposed to the seat members 20.
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