SUBSTRATE FOR POWER MODULE WITH HEAT SINK AND METHOD FOR PRODUCING THE SAME, POWER MODULE WITH HEAT SINK, AND SUBSTRATE FOR POWER MODULE

摘要

Disclosed is a substrate for a power module with a heat sink, which comprises a substrate (11) for power modules comprising an insulating substrate (12) having a first side (12a) and a second side (12b), a circuit layer (13) formed on the first side (12a) and a metal layer (14) formed on the second side (12b), and a heat sink (17) for cooling the substrate (11) for power modules, which is directly bonded to the metal layer (14). When the thickness of the circuit layer (13) is represented by A and the thickness of the metal layer (14) is represented by B, the ratio B/A is set within the range of 1.5 = B/A = 20.