发明名称 |
DIE SUBSTRATE WITH REINFORCEMENT STRUCTURE |
摘要 |
<p>Various semiconductor chip package substrates with reinforcement and methods of making the same are disclosed. In one aspect, a method of manufacturing is provided that includes providing a package substrate that has a first side and a second side opposite to the first side. The first side has a central area adapted to receive a semiconductor chip. A solder reinforcement structure is formed on the first side of the package substrate outside of the central area to resist bending of the package substrate.</p> |
申请公布号 |
WO2009115910(A1) |
申请公布日期 |
2009.09.24 |
申请号 |
WO2009IB00561 |
申请日期 |
2009.03.19 |
申请人 |
ATI TECHNOLOGIES ULC;ATI INTERNATIONAL SRL;TOPACIO, RODEN;ZBRZEZNY, ADAM |
发明人 |
TOPACIO, RODEN;ZBRZEZNY, ADAM |
分类号 |
H01L23/00;H01L23/16;H01L23/31 |
主分类号 |
H01L23/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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