CHEMICAL-MECHANICAL POLISHING PAD, AND CHEMICAL-MECHANICAL POLISHING METHOD

摘要

PROBLEM TO BE SOLVED: To provide: a chemical-mechanical polishing pad capable of preventing damage of a polishing layer during chemical-mechanical polishing; and a chemical-mechanical polishing method capable of carrying out high-quality chemical-mechanical polishing over a long time by using the chemical-mechanical polishing pad.

SOLUTION: This chemical-mechanical polishing pad 10 used for chemical-mechanical polishing includes a polishing layer 11 having a polishing surface 20, a non-polishing surface 22 located on the side opposite to the polishing surface, and a recessed part 24 formed in a region including a center part of the non-polishing surface. The recessed part is provided with a plurality of bottom parts 25 and 26 having depths different from one another.

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