| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a safe cleaning method capable of removing accumulated deposits without giving damage to semiconductor manufacturing device parts made of an aluminum metal or an aluminum alloy. <P>SOLUTION: The cleaning is performed by both steps of: (a) cleaning the semiconductor manufacturing device parts with a composition containing fluoride, carboxylic acid and boric acid in a composition ratio (weight ratio) of, for example, 1 ppm to 4%, 0.1 to 20% and 0.1 to 5%; and (b) cleaning the semiconductor manufacturing device parts with a composition containing a nonionic surfactant and/or an oxidizing agent in an amount of 0.01 to 10% by weight. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
