| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To balance ease of heat radiation of a semiconductor device and difficulty of heat transfer from the semiconductor device to the periphery component in a semiconductor circuit configured by the semiconductor device and the periphery component which has an allowable temperature lower than an operation temperature of the semiconductor device. <P>SOLUTION: In a semiconductor circuit, a semiconductor device (110) and a periphery component (120) which has an allowable temperature lower than an operation temperature of the semiconductor device (110) are connected by a wiring route. In the semiconductor circuit, between a region to which the semiconductor device (110) is connected and a region on which the periphery component (120) is mounted, a heat transfer adjusting part (150) configured by an electrical insulating material having a heat conductivity different from that of the region is provided. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
