发明名称 METAL FOIL PLATED LAMINATED BOARD AND PRINTED WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a metal foil plated laminated board from which a printed wiring board, that is excellent in heat resistance, can sufficiently reduce occurrence of camber and can be optionally bent, can be manufactured and to provide the printed wiring board using the metal foil plated laminated board. SOLUTION: A fiber base material is a glass cloth having thickness of 50μm or less. A metal foil with a resin icnludes a metal foil and a resin layer consisting of a resin composition which is formed on the metal foil and cures with heat. The fiber base material and a pair of metal foils with the resin are arranged so that the resin layer comes into contact with the fiber base material and are integrated by applying heat and pressure to form the metal foil plated laminated board. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009214525(A) 申请公布日期 2009.09.24
申请号 JP20080068086 申请日期 2008.03.17
申请人 HITACHI CHEM CO LTD 发明人 TAKEUCHI KAZUMASA;YAMAGUCHI MAKI
分类号 B32B15/08;C08J5/04;H05K1/03 主分类号 B32B15/08
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