| 摘要 |
PROBLEM TO BE SOLVED: To provide an imaging apparatus that prevents a portion of the exterior close to the peripheral circuit of an imaging element from locally becoming hot. SOLUTION: An imaging substrate 302 comprises a flexible substrate portion 312A, a flexible substrate portion 312B, a hard substrate portion 314A where the imaging element 14 is mounted, and a hard substrate portion 314B where the peripheral circuit 300 of the imaging element 14 is mounted. The hard substrate portion 314A and hard substrate portion 314B are coupled together via the flexible substrate portion 312A. The hard substrate portion 314A is disposed on a plane orthogonal to the optical axis 316 of a photographing lens stored in the lens barrel 106 and between the lens barrel 106 and the exterior 320 of the back of an imaging apparatus body. The hard substrate portion 314B is disposed on a plane parallel to the optical axis 316 of the photographing lens and between the side surface of the lens barrel 106 and a battery storage chamber 306. COPYRIGHT: (C)2009,JPO&INPIT
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