| 发明名称 |
THERMALLY CONDUCTIVE ARAMID-BASED DIELECTRIC SUBSTRATE FOR PRINTED CIRCUIT BOARD AND FOR IC CHIP PACKAGE |
| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a sheet useful as thermally conductive printed circuit board substrates or as components of thermally-conductive IC chip packages. <P>SOLUTION: A fiber-based reinforced composite sheet is provided, comprising one or more woven or unwoven para-aramid or glass fiber cloths, sheets, or papers, the sheet being impregnated with a polymer matrix containing at least one polymer and a thermally conductive filler component suitable to conduct heat. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
| 申请公布号 |
JP2009215532(A) |
申请公布日期 |
2009.09.24 |
| 申请号 |
JP20080308828 |
申请日期 |
2008.12.03 |
| 申请人 |
E I DU PONT DE NEMOURS & CO |
发明人 |
KANAKARAJAN KUPPUSAMY;HUTTON RALPH;MILASINCIC CHRISTOPHER J |
| 分类号 |
C08J5/24;B32B15/08;C08J5/00;H05K1/03 |
主分类号 |
C08J5/24 |
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