发明名称 METHOD FOR MANUFACTURING MULTIPLY-PRODUCED WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a method for manufacturing a multiply-produced wiring board with a plurality of green sheets laminated hard to generate a waste material or the like of a metalized layer formed on the surface after the split. SOLUTION: A base green sheet bg comprises: a product area composed with a plurality of green sheets g1 to g4 laminated, and continuously having lengthwise and breadthwise a plurality of product parts p which become the wiring board after the split having the surface 3 and the rear surface 4; and a rear surface side concave part 7 opening at the rear surface 4, formed in intersecting with a cutting-planned surface c comparting the adjacent product parts p, not exposing to the surface 3, and having an unbaked metalization layer 9 on the inner wall surface. The method for manufacturing the multiply-produced wiring board 1 comprises a step of inserting a blade B1 having a blade angleθ1 of not less than 22°nor more than 30°along the cutting-planned surface c comparting each product part p from the surface 3 side of the sheet bg to form a first break groove v1 having the cross section of the angle same as the blade angleθ1. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009218319(A) 申请公布日期 2009.09.24
申请号 JP20080059152 申请日期 2008.03.10
申请人 NGK SPARK PLUG CO LTD 发明人 HASEGAWA MASAMI;ITAI MOTOHIKO;SHIRAISHI MITSUO;KATO ONORI;SUZUKI ATSUSHI;FUKUNAGA KAZUNORI
分类号 H05K3/00;H01L23/12;H05K1/02 主分类号 H05K3/00
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