| 摘要 |
PROBLEM TO BE SOLVED: To provide a board peeling apparatus and a board peeling method by which the peeling of two boards under a closely joined state, which has conventionally been difficult, becomes easy, and which are used for the peeling between a mold for imprints and the board without generating defects such as a pattern missing especially in nano imprints. SOLUTION: This board peeling apparatus which peels two boards under the closely joined state has a peeling starting means, a board fixing means, a board holding means, and a high pressure air discharging means. In this case, the peeling starting means has a high pressure air discharging port between two pieces of approached blades which have a wedge-like cross section. The board fixing means fixes one of the two boards. The board holding means holds the other board which is not fixed. The high pressure air discharging means discharges high pressure air to a gap between the two boards. COPYRIGHT: (C)2009,JPO&INPIT
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