| 摘要 |
Integrated circuit dies, integrated circuit packages, and methods for assembling the same are provided. An integrated circuit package includes a substrate, an integrated circuit die, a plurality of electrically conductive bump interconnects, an electrically conductive material, and one or more bond wires. The electrically conductive bump interconnects mount a first surface of the die to a first surface of the substrate. The electrically conductive material forms an electrically conductive path from a first electrically conductive feature on the first surface of the die to a second electrically conductive feature on the second surface of the die. The bond wire couples the second electrically conductive feature to a third electrically conductive feature on the first surface of the substrate. In this manner, flip chip bump interconnects and bond wires are available to interface signals of the die with the substrate.
|
