发明名称 |
INTEGRATED CIRCUIT PACKAGE SYSTEM FOR STACKABLE DEVICES |
摘要 |
An integrated circuit package system includes: providing a lower interposer substrate with lower exposed conductors; attaching a die over the lower interposer substrate; applying a stack encapsulant over the die and the lower interposer substrate having the lower exposed conductors partially exposed adjacent the stack encapsulant; and attaching an upper interposer substrate having upper exposed conductors over the stack encapsulant and with the upper exposed conductors substantially exposed.
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申请公布号 |
US2009236753(A1) |
申请公布日期 |
2009.09.24 |
申请号 |
US20080052910 |
申请日期 |
2008.03.21 |
申请人 |
MOON DONGSOO;SONG SUNGMIN |
发明人 |
MOON DONGSOO;SONG SUNGMIN |
分类号 |
H01L23/52 |
主分类号 |
H01L23/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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