| 摘要 |
PURPOSE: A wire bonding capillary automatic dispenser for semiconductor is provided to improve the load of the capillary magazine. CONSTITUTION: The wire bonding capillary automatic dispenser for the semiconductor includes a cabinet, the enclosing main body(200), the drive motor(300), the hopper(400), and the supply action means. The cabinet includes the issuing unit(110) and collecting part about the capillary magazine. The enclosing main body is installed in the cabinet. The enclosing main body includes the receiving space(210), and the vessel extract and discharge roller(220). The drive motor moves the discharge roller. The hopper guides the capillary magazine ejected through the discharge roller to the issuing unit. The supply action means is connected to the drive motor.
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