| 发明名称 |
COPPER ALLOY MATERIAL FOR ELECTRIC AND ELECTRONIC COMPONENTS |
| 摘要 |
<p>Disclosed is a copper alloy material for electric and electronic components, which is a copper alloy material comprising 0.5-2.5 mass% Co and 0.1-1.0 mass% Si, wherein Co/Si = 3-5 (mass ratio), and the remainder of which is Cu and unavoidable impurities, and which is solution heat-treated at 800-960ºC, and at a temperature (ºC) lower than -122.77X2 + 409.99X + 615.74 when the Co content (mass%) is X.</p> |
| 申请公布号 |
WO2009116649(A1) |
申请公布日期 |
2009.09.24 |
| 申请号 |
WO2009JP55531 |
申请日期 |
2009.03.19 |
| 申请人 |
THE FURUKAWA ELECTRIC CO., LTD.;MATSUO, RYOSUKE;EGUCHI, TATSUHIKO;MIHARA, KUNITERU |
发明人 |
MATSUO, RYOSUKE;EGUCHI, TATSUHIKO;MIHARA, KUNITERU |
| 分类号 |
C22C9/06;C22F1/00;C22F1/08;H01B1/02 |
主分类号 |
C22C9/06 |
| 代理机构 |
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