| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and system for surface inspection of die bonding film which can evaluate status of defective irregularity occurred on the die bonding film surface with complete efficiency and high precision. SOLUTION: This invented surface inspection method is to inspect status of defective irregularity occurred on the die bonding film surface and includes a light irradiation process to irradiate light on the surface of die bonding film, a light intensity detection process to detect intensity of reflected light from the die bonding film through light-receiving means, and a calculation process for calculating and quantifying the status of defective irregularity occurred on the die bonding film surface based on output signal from the light-receiving means. COPYRIGHT: (C)2009,JPO&INPIT |
