发明名称 |
CONDUCTIVE STRUCTURE OF A CHIP AND METHOD FOR MANUFACTURING THE SAME |
摘要 |
A conductive structure of a chip and a method for manufacturing the conductive structure are provided. An under bump metal (UBM) is formed on the redistribution layer (RDL) by performing an electroless plating process. Subsequently, the solder bump is formed on the under bump metal for electrical connection. Thus, the photomask can be economized and the cost of manufacturing can be reduced.
|
申请公布号 |
US2009236741(A1) |
申请公布日期 |
2009.09.24 |
申请号 |
US20080262682 |
申请日期 |
2008.10.31 |
申请人 |
HUANG HSIANG-MING;LIU AN-HONG;LEE YI-CHANG;TSAI HAO-YIN;HO SHU-CHING |
发明人 |
HUANG HSIANG-MING;LIU AN-HONG;LEE YI-CHANG;TSAI HAO-YIN;HO SHU-CHING |
分类号 |
H01L23/488;H01L21/44 |
主分类号 |
H01L23/488 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|