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发明名称
Massebondverbindung
摘要
申请公布号
DE112008000091(A5)
申请公布日期
2009.09.24
申请号
DE200811000091T
申请日期
2008.03.11
申请人
CONTI TEMIC MICROELECTRONIC GMBH
发明人
HENNIGER, JUERGEN;VOEGERL, ANDREAS;ALBERT, ANDREAS;OED, HARALD;BUHL, JOACHIM;FALKNER, ROLAND;WENK, ALEXANDER;BAUER, GERHARD;WIECZOREK, MATTHIAS;HIRMER, CHRISTIAN;KARRER, HELMUT;URBANEK, THOMAS
分类号
B60R16/023;F16H61/00
主分类号
B60R16/023
代理机构
代理人
主权项
地址
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