| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a film-forming device and a film formation method capable of improving a film formation atmosphere, and to form a film having good characteristics by the device and the method. <P>SOLUTION: The film-forming device performs heat treatment for a liquid material 3 arranged on a substrate S1 in a treatment chamber 11 to solidify the liquid material. In the treatment chamber, the device includes: a stage 15 on which the substrate is mounted; a heating means 15a for heating the substrate; a cover 17 for covering the substrate; and a supply means for supplying inert gas N<SB>2</SB>into the cover. For example, the inert gas supplied into the cover is discharged from a space at the bottom of the sidewall of the cover. By the device, the heat treatment is performed while the cover restricts ambient gas with which the liquid material on the substrate can come into contact. Also, the heat treatment is performed while continuously supplying clean inert gas onto the liquid material on the substrate, and discharging impurities, such as reactive gas (cracked gas) generated by heating, to the outside of the cover. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
