| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To prevent a chip carrier from reaching a temperature higher than needed in order to prevent its transformation from occurring in bump formation of a flip chip semiconductor device, and further, to prevent bump forming productivity slowdown by fixation of a chip carrier and a chip caused by an adhesive for a dicing tape. <P>SOLUTION: A semiconductor chip is placed onto a chip mount of a chip carrier having an opening at its bottom, a protrusion of a bumps forming device, at least whose top surface is smoothed out by a coating film, is made to penetrate through the opening from bottom up, and the semiconductor chip is fixed to the upper surface, thus forming bumps on the surface of the semiconductor chip. By these steps, an excessive rise of the chip carrier's temperature is controlled, and further, even if an adhesive remains attached to the backside of the semiconductor, the situation that the fixing of the upper surface of the protrusion and the semiconductor chip, as well as that of the chip carrier and the chip, makes it difficult for the two to be separated can be avoided without a hitch. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
