ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide an electronic device that suppresses breakage of a joint caused by a difference in thermal expansion coefficient between a semiconductor chip and a wiring substrate after mounting the semiconductor chip to the wiring substrate.

SOLUTION: A semiconductor chip includes a wiring substrate and a chip component 4. The wiring substrate includes an insulating resin layer 1 having first/second main faces, and a first wiring layer 2 arranged on the second main face side of the insulating resin layer 1. The chip component 4 includes bump electrodes 5 on its lower face. The insulating resin layer 1 holds the chip component 4 while the lower face and the side faces of the chip component 4 are in contact with the insulating resin layer 1 and the upper face of the chip component 4 is exposed on the first main face side of the insulating resin layer 1. Each bump electrode 5 of the chip component is connected with the first wiring layer 2. The chip component 4 further protrudes than the first main face of the insulating resin layer 1.

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