| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for confirming a junction state of wire bonding, which can perform a highly reliable inspection by improving inspection accuracy. <P>SOLUTION: The method includes: a dummy bonding step of joining both ends of each dummy bonding wire 5 together with a lead part 3 arranged on the outside of a semiconductor element 2 before performing a wire bonding process; a position adjusting step of adjusting the positions of tools of bonding wires 4 and the positions of the bonding wires 4 by the dummy bonding process; and a junction strength inspection step of measuring junction strength by separating the dummy bonding wires 5 formed by the dummy bonding process. <P>COPYRIGHT: (C)2009,JPO&INPIT |
