| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that the micro-joint of substrate becomes dust and scattered dust sticks to substrates, affecting electronic components, at the time when a multiple substrate in which a plurality of substrates are jointed by micro-jointing, on which components are mounted, is split into pieces. SOLUTION: A substrate cutting apparatus has such configuration as a mounting surface for electronic components of a multiple substrate is covered with an upper cover jig, and the upper cover jig is tightly contacted to the end face near the micro-joint of the substrate, for clamping the substrate. At the same time, a through-hole in which a router bit for cutting is inserted is provided near the micro-joint of the upper cover jig, thereby preventing sticking of dust to the substrate when cutting. COPYRIGHT: (C)2009,JPO&INPIT
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