发明名称 |
PATTERN TRANSFER MOLD AND PATTERN TRANSFER METHOD |
摘要 |
A pattern transfer mold is suitable for transferring at least one decorative pattern of a film to at least one workpiece. The pattern transfer mold includes a mold base and a mold core. The mold base has a mold cavity and an air vent associated with the mold cavity. The mold core is inserted in the mold cavity of the mold base and has an upper surface and a plurality of upper air grooves on the upper surface. The mold cavity and the mold core have a plurality of mold air channels located between the mold cavity and the mold core. The upper air grooves are associated with the air vent via the mold air channels.
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申请公布号 |
US2009236772(A1) |
申请公布日期 |
2009.09.24 |
申请号 |
US20080325265 |
申请日期 |
2008.12.01 |
申请人 |
COMPAL ELECTRONICS, INC. |
发明人 |
CHANG CHIEN-MIN;WU JUNG-CHIN;CHUANG WAN-LI;WANG HO-HSIANG |
分类号 |
B29C59/02 |
主分类号 |
B29C59/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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