发明名称 PATTERN TRANSFER MOLD AND PATTERN TRANSFER METHOD
摘要 A pattern transfer mold is suitable for transferring at least one decorative pattern of a film to at least one workpiece. The pattern transfer mold includes a mold base and a mold core. The mold base has a mold cavity and an air vent associated with the mold cavity. The mold core is inserted in the mold cavity of the mold base and has an upper surface and a plurality of upper air grooves on the upper surface. The mold cavity and the mold core have a plurality of mold air channels located between the mold cavity and the mold core. The upper air grooves are associated with the air vent via the mold air channels.
申请公布号 US2009236772(A1) 申请公布日期 2009.09.24
申请号 US20080325265 申请日期 2008.12.01
申请人 COMPAL ELECTRONICS, INC. 发明人 CHANG CHIEN-MIN;WU JUNG-CHIN;CHUANG WAN-LI;WANG HO-HSIANG
分类号 B29C59/02 主分类号 B29C59/02
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