发明名称 |
THERMOSETTING RESIN COMPOSITION AND UNCURED FILM COMPRISING THE SAME |
摘要 |
To provide a thermosetting resin composition having excellent film-forming properties, which can form a cured product having low elastic modulus and having low dielectric constant and low dielectric loss tangent in a high frequency range; and a thermosetting resin composition comprising (A) a vinyl compound represented by the general formula (1), and (B) a rubber and/or a thermoplastic elastomer.
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申请公布号 |
US2009239992(A1) |
申请公布日期 |
2009.09.24 |
申请号 |
US20070309979 |
申请日期 |
2007.08.08 |
申请人 |
YAMADA TOSHIAKI;IIDA HIDENORI;ANBAI YASUKAZU;TERAKI SHIN;YOSHIDA MASAKI;TAKAHASHI SATOKO |
发明人 |
YAMADA TOSHIAKI;IIDA HIDENORI;ANBAI YASUKAZU;TERAKI SHIN;YOSHIDA MASAKI;TAKAHASHI SATOKO |
分类号 |
A61K8/33;C08G61/10 |
主分类号 |
A61K8/33 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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