LED LEAD FRAME, LED PACKAGE USING THE SAME AND MANUFACTURING METHOD THEREOF

摘要

This invention provides an LED package that can be fabricated at low cost. In addition, the invention enables manufacturers to stabilize the productivity of the LED package and enhance the yield rate thereof remarkably when fabricating the LED package in bulk. For these purposes, the LED package in the invention comprises: a plate, an LED chip that is bonded to the plate, a primary medium on the plate that covers the LED chip and emits a light having a wavelength different from that of the light from the LED chip, a second medium that is formed on the first medium, and a regulator that manipulates the surface area of the first medium. The light from the LED chip penetrates through the first medium and the second medium.