发明名称 |
ELECTRONIC DEVICE PACKAGE AND METHOD OF FORMATION |
摘要 |
Provided are electronic device packages and their methods of formation. The electronic device packages include a sealed volume enclosing an electronic device and a feedthrough into the sealed volume for electrical connection of the electronic device. Provided are optoelectronic device packages and their methods of formation. The optoelectronic device packages include a first substrate and lid attached to the first substrate forming an enclosed volume. An optoelectronic device is disposed within the enclosed volume and a wick stop for preventing solder flow is provided. Provided are prism-coupled optical assemblies which allow for the coupling of light between an optical component, such as a laser, and an integrated optical waveguide through a prism. |
申请公布号 |
WO2009079651(A3) |
申请公布日期 |
2009.09.24 |
申请号 |
WO2008US87531 |
申请日期 |
2008.12.18 |
申请人 |
NUVOTRONICS, LLC;HOGAN, WILLIAM, K. |
发明人 |
HOGAN, WILLIAM, K. |
分类号 |
H01L23/48;H01L21/60 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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