| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a circuit board and a method of attaching a semiconductor device to the circuit board, which suppresses corrosion and disconnection caused in a wiring pattern of the circuit board when thermally pressure-bonding other semiconductor device or the like onto the circuit board by using an anisotropic conductive adhesive. <P>SOLUTION: In the circuit board 1, a conductive film 12 and an insulation film 39 covering the conductive film 12 are laminated on a substrate 2. The internal stress of the insulation film 39 becomes a compressive stress, and the semiconductor device 7 is mounted on the insulation film 39 so as to hold an anisotropic conductive adhesive material 46 between the semiconductor device 7 and the insulation film 39. When thermally pressure-bonding the semiconductor device 7 onto the circuit board 1 by using the anisotropic conductive adhesive material 46, corrosion of the conductive film 12 on a uncured part of the anisotropic conductive adhesive 46 can be reduced and disconnection of the wiring formed on the conductive film 12 can be reduced. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
