| 摘要 |
PROBLEM TO BE SOLVED: To satisfactorily and evenly apply heat to an overall substrate without causing dent or scratches around the center of the substrate by contact with a support member such as a proximity pin or causing faulty heating, in a substrate heater used for heating various substrates including a semiconductor wafer and a substrate for an electro-optical device such as a liquid crystal device and a manufacturing apparatus of the electro-optical device. SOLUTION: In the substrate heater for heating, by a hot plate 1, a substrate 3 disposed with a predetermined clearance above the hot plate 1, the substrate 3 is supported with a predetermined clearance above the hot plate 1 via support members 2 provided around the substrate 3, and a heating surface 1a on the top of the hot plate 1 is curved substantially along a warpage occurring on the substrate 3 due to the self weight of the substrate 3. COPYRIGHT: (C)2009,JPO&INPIT |
