| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition of low dielectric loss, and a prepreg, a resin-bearing metallic foil, an adhesive film, a metallic-foil-clad laminated board, and a printed wiring board, each using the same. SOLUTION: The resin composition containing a silicone resin is provided. A prepreg, a resin-bearing metallic foil, an adhesive film, a metallic-foil-clad laminated board, and a printed wiring board, each using the same, are also provided. COPYRIGHT: (C)2009,JPO&INPIT
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