| 摘要 |
PROBLEM TO BE SOLVED: To provide spherical particles which are dense and good in the degree of sphericity and can be highly densely filled into a sealing resin, while containing much highly thermal conductive magnesium oxide, a resin composition containing the spherical particles and a method of manufacturing the same, as well as a filler which is an aggregate of the spherical particles, and also a semiconductor resin sealing agent containing the same. SOLUTION: The spherical particles are constituted of magnesium oxide and Mg<SB>2</SB>SiO<SB>4</SB>, and characterised in that the aspect ratio of major side to minor side is 1.0-1.1 in average. Also, the manufacturing method of the spherical particles is characterised by being provided with a first process for obtaining spherical particles having amorphous phase as a main phase by cooling molten particles constituted of Si, Mg and O, and a second process for obtaining the spherical particles by crystallizing them by heating the spherical particles having the amorphous phase as main phase. COPYRIGHT: (C)2009,JPO&INPIT
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