发明名称 SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a substrate processing device and a substrate processing method that use a low-surface-tension solvent such as IPA to dry a substrate surface getting wet with a processing liquid, the substrate processing device and the substrate processing method preventing trouble such as the occurrence of a watermark on the substrate and destruction of a pattern on the substrate surface. SOLUTION: While a rinse liquid sticking on the substrate surface Wf is replaced with an IPA liquid, clean dry air (CDA) is supplied to a gap space SP to keep a periphery atmosphere of the substrate surface Wf at a low-humidity atmosphere. Consequently, absorption of water by the IPA liquid discharged from an IPA liquid discharge hole 97a is suppressed. After the replacement with the IPA liquid, the IPA liquid is removed from the substrate surface Wf to dry the surface Wf, in such a case, the water absorption by the IPA liquid is suppressed, so that remaining of water in the IPA liquid on the substrate surface Wf is securely suppressed through the drying process to effectively suppress the occurrence of the watermark and pattern destruction. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009218376(A) 申请公布日期 2009.09.24
申请号 JP20080060515 申请日期 2008.03.11
申请人 DAINIPPON SCREEN MFG CO LTD 发明人 MIYA KATSUHIKO
分类号 H01L21/304 主分类号 H01L21/304
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