发明名称 Package structure for light emitting diode
摘要 A package structure for light emitting diode (LED) comprises a base, an LED die, an optical lens and a lens holder. The base comprises at least one holder cavity formed on its surface and at least one chase formed on its side surface. The lens holder comprises an opening, at least one holder stem and at least one wedge. The optical lens is arranged between the lens holder and the base, and also through the opening. The lens holder is fastened on the base by wedging the wedge with the chase and positioned on the base by embedding the holder stem into the holder cavity to enhance the positioning between the optical lens and the base, such that the optical lens can generate a desired light pattern. Therefore, the required time of a packaging process can be reduced, and the lens holder can be removed simply for replacing the optical lens, so the objective of changing the light pattern quickly can be achieved.
申请公布号 US2009237942(A1) 申请公布日期 2009.09.24
申请号 US20080284370 申请日期 2008.09.22
申请人 E-PIN OPTICAL INDUSTRYCO., LTD. 发明人 LAM CHU-FONG;LIAO YI-FAN
分类号 F21V13/04;F21V5/04 主分类号 F21V13/04
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