| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a flip-chip mounting structure suitable for a semiconductor device having SIP (single in line package) structure, which will not cause solder cracks in an Au alloy bump by repeated reflow processing. <P>SOLUTION: The semiconductor device is composed of an Sn alloy, containing Au-(Ag, Cu) binary alloy or Au-(Pd, Pt, Ni) binary alloy having melting point of 180-270°C and Sn of 90 mass%, or an Sn metal having a purity of ≥99.9 mass% and, further, the volume proportion of the Au-(Ag, Cu) binary alloy to the Sn alloy or the Sn metal is within the range of 1:5-20. <P>COPYRIGHT: (C)2009,JPO&INPIT |
