| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To effectively suppress occurrence of local swellings in a circuit board. <P>SOLUTION: A through-hole 29b is formed in an intermediate part 20b between a center part 20a including an area of a circuit board 20, on which a semiconductor chip 30 is arranged, and a peripheral part 20c including an area for forming a pad 21c for connecting the semiconductor chip 30 to the circuit board 20 through an Au wire 50. Since the through-hole 29 is formed in the area, separation between a ground plane wire 22a and a prepreg layer 27 and separation between a power supply plane wire 23a and a prepreg layer 28 can be suppressed during the reflow or the like of solder balls 70, and occurrence of swellings in the circuit board 20 centering on the intermediate part 20b, which may occur when the through-hole 29b is not formed, can be effectively suppressed. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
