发明名称 PACKAGE FOR STORING ELECTRONIC ELEMENT, AND ELECTRONIC DEVICE
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a package for storing an electronic element 4 in which no air is contained in a joining layer 3 and the base 1 and frame 2 are tightly joined together when a base 1 and a frame 2 are joined together. <P>SOLUTION: The package for storing the electronic element includes at least the base and frame joined together with the joining layer, and 30% or more of a bottom surface of the frame is inclined at an angle of 0.5 to 15°in the inside-outside direction of the frame. <P>COPYRIGHT: (C)2009,JPO&INPIT</p>
申请公布号 JP2009218512(A) 申请公布日期 2009.09.24
申请号 JP20080063252 申请日期 2008.03.12
申请人 NIPPON CARBIDE IND CO INC 发明人 KAWAURA SHIGEHIRO;IDA MAKOTO
分类号 H01L23/02 主分类号 H01L23/02
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