发明名称 |
PACKAGE FOR STORING ELECTRONIC ELEMENT, AND ELECTRONIC DEVICE |
摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a package for storing an electronic element 4 in which no air is contained in a joining layer 3 and the base 1 and frame 2 are tightly joined together when a base 1 and a frame 2 are joined together. <P>SOLUTION: The package for storing the electronic element includes at least the base and frame joined together with the joining layer, and 30% or more of a bottom surface of the frame is inclined at an angle of 0.5 to 15°in the inside-outside direction of the frame. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
申请公布号 |
JP2009218512(A) |
申请公布日期 |
2009.09.24 |
申请号 |
JP20080063252 |
申请日期 |
2008.03.12 |
申请人 |
NIPPON CARBIDE IND CO INC |
发明人 |
KAWAURA SHIGEHIRO;IDA MAKOTO |
分类号 |
H01L23/02 |
主分类号 |
H01L23/02 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|