发明名称 HIGH FREQUENCY SUBSTRATE
摘要 <P>PROBLEM TO BE SOLVED: To provide a high frequency substrate that easily adjusts an insertion loss of substrate wiring lines even after wiring lines are arranged. <P>SOLUTION: Slits 5-1 to 5-6 are created at positions opposite to a signal line 4 on a GND layer 1. When an insertion loss of the high frequency substrate is adjusted, the slits 5-1 to 5-6 are closed with a conductive resin 6. The conductive resin 6 slightly transmits electricity, so that signals leak through the conductive resin 6 that closes the slits and the electric power of transmission signals decreases. Thereby, the insertion loss of the high frequency substrate is increased by closing the slits 5-1 to 5-6 with the conductive resin 6. <P>COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009218841(A) 申请公布日期 2009.09.24
申请号 JP20080060237 申请日期 2008.03.10
申请人 TOSHIBA CORP 发明人 YAMASHITA YUSUKE
分类号 H01P1/22;H01P3/08 主分类号 H01P1/22
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