发明名称 CONDUCTIVE MATERIAL PRECURSOR, AND CONDUCTIVE MATERIAL
摘要 PROBLEM TO BE SOLVED: To provide a conductive material being excellent in an adhesion property and flexibility between a silver image and a plated metal layer, and a support body even though applying plating treatment, and to provide a conductive material precursor for obtaining the conductive material. SOLUTION: In the conductive material precursor having at least a physical-developing nucleus layer and a silver halide emulsion layer on the support body in this order, an amount of a binder included in the physical-developing nucleus layer is 100 mg/m<SP>2</SP>or more, and 50 wt.% or more of the binder is polymer latex. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009218004(A) 申请公布日期 2009.09.24
申请号 JP20080058413 申请日期 2008.03.07
申请人 MITSUBISHI PAPER MILLS LTD 发明人 YOSHIKI TAKENOBU
分类号 H01B13/00;H01B5/14 主分类号 H01B13/00
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