METHOD OF APPLYING CATALYTIC SOLUTION FOR USE IN ELECTROLESS DEPOSITION
摘要
An improved method of activating a surface to receive electroless metal plating thereon, particularly for use in activating through holes in printed circuit substrates, in which the activating solution comprising a palladium tin colloid in an acidic aqueous matrix is sparged with nitrogen gas to slow the oxidation of stannous tin contained therein. A dynamic flood conveyorized system to perform said activation is described.
申请公布号
WO2009117226(A1)
申请公布日期
2009.09.24
申请号
WO2009US35217
申请日期
2009.02.26
申请人
MACDERMID, INCORPORATED;DECESARE, WILLIAM;WATKOWSKI, JAMES