NI-P LAYER SYSTEM AND PROCESS FOR ITS PREPARATION

摘要

The invention relates to a layer system comprising on a substrate, the surface of which has been electropolished, (i) a Ni layer having a thickness = 3.0 µm, (ii) a Ni-P layer having a thickness = 1.0 µm, (iii) a Au layer having a thickness = 1.0 µm.