| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an improved wiring substrate and its manufacturing method, wherein the generation of stress between an electronic component and a substrate is suppressed while connection reliability is maintained. <P>SOLUTION: In the wiring substrate 100 comprising at least one insulating layer, at least one insulating layer of the wiring substrate has a stiffness distribution in the same plane, and stiffness is set relatively high in a region comprising an electrode where at least an electronic component 200 is mounted. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
