| 摘要 |
A laminate comprising: an insulated substrate, an insulating resin layer having an imide bond and/or amide bond superimposed on the insulated substrate, and a metal thin film layer involving a structure having metal particles fusion bonded to each other, superimposed on the insulating resin layer, wherein the insulating resin layer sticks fast to the metal thin film layer in such a fashion that some of the fusion bonded metal particles are buried in the insulating resin layer, and wherein a metal oxide is present at a contact interface of the insulating resin layer with the metal thin film layer.
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