SEMICONDUCTOR DEVICE STORAGE PACKAGE FOR OPTICAL COMMUNICATION

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device storage package for optical communication that prevents peeling-off of a lead by reducing stress occurring at a lead end part joined to ceramics even when the lead is deformed by warpage of a printed circuit board or the like.

SOLUTION: The semiconductor device storage package 1 for optical communication has an almost box shape and is configured as follows. A KV ring 8 for fixing a cable 7 that passes an optical signal therethrough is joined to a through-hole drilled in the front face of a KV-made base body 2 having a cavity in its inside. A ceramic-made insulator 6 is installed inside the cavity so as to be partially exposed from a cutout part 10 drilled in the bottom face of the base body 2 to which a heat-dissipation plate 3 is joined. A conductor wiring pattern made conductive to a semiconductor device is formed on the insulator 6. One end of a lead 4b is joined to a terminal part 5 formed in the conductor wiring pattern exposed from the cutout part 10. A part P of the lead extended from the edge part 2a of the base part 2 to the outside is formed into an almost crank shape in a planar view.

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