摘要 |
PROBLEM TO BE SOLVED: To improve electrical crosstalk and to suppress short circuit between light emitting elements. SOLUTION: This semiconductor light emitting device has a plurality of semiconductor light emitting parts M<SB>1</SB>to M<SB>4</SB>juxtaposed on a semiconductor substrate 1, electrodes A<SB>1</SB>to A<SB>4</SB>, a plurality of conductive layers L<SB>1</SB>to L<SB>4</SB>formed along a direction crossing the arrangement direction of the semiconductor light emitting parts, wide bonding pad parts PD<SB>1</SB>to PD<SB>4</SB>extendedly provided at the end parts thereof, and separated regions 22, 22<SB>DB</SB>formed between respective semiconductor light emitting parts, between semiconductor light emitting parts and the bonding pad parts, and between the bonding pad parts adjacent to each other. COPYRIGHT: (C)2009,JPO&INPIT
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