| 摘要 |
A semiconductor device may include at least one active region that has at least one trench groove. A fin channel region is deposed in the active region and between the at least one trench groove and an isolation region of the semiconductor substrate. The gate insulating film is disposed on inside walls of the at least one trench groove. The gate electrode is disposed on the gate insulating film and in the at least one trench groove. The gate electrode is separated by the gate insulating film from the fin channel region. The source and drain regions are disposed in the active region, and are connected to the fin channel region. The junction of each of the source and drain regions with the semiconductor substrate is deeper than the bottom of the fin channel region.
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