| 摘要 |
It is provided a chip 12 having a supporting substrate 2, a wavelength conversion layer 5, a base adhesive layer 3 made of an organic resin, an upper-side substrate 11 provided on an upper surface side of the wavelength conversion layer 5, and an upper-side adhesive layer 10 made of an organic resin for adhering the wavelength conversion layer 5 to the upper-side substrate 11. The wavelength conversion layer 5 has an optical waveguide with a periodic domain inversion structure provided therein. The chip 12 is heat treated. Anti-reflection films are formed on an incident side end face and projection side end face of the optical waveguide, respectively.
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