发明名称 FILM FORMATION APPARATUS FOR SEMICONDUCTOR PROCESS AND METHOD FOR USING SAME
摘要 A method for using a film formation apparatus includes, in order to inhibit metal contamination: performing a cleaning process using a cleaning gas on an inner wall of a process container and a surface of a holder with no productive target objects held thereon; and then, performing a coating process of forming a silicon nitride film by alternately supplying a silicon source gas and a nitriding gas to cover with the silicon nitride film the inner wall of the process container and the surface of the holder with no productive target objects held thereon.
申请公布号 US2009233454(A1) 申请公布日期 2009.09.17
申请号 US20090401214 申请日期 2009.03.10
申请人 TOKYO ELECTRON LIMITED 发明人 OKADA MITSUHIRO;TONEGAWA YAMATO
分类号 H01L21/316;B05C11/10;B05D7/22;H01L21/318 主分类号 H01L21/316
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