A semiconductor package is provided to form a mark pattern in a semiconductor chip without a separate marking process by attaching a protective member in which the mark pattern is formed. A semiconductor chip(100) has a first surface(110), a second surface(120), and a bonding pad. The first surface is faced with the second surface. The bonding pad is arranged on the first surface. A protective member(200) is attached on the second surface. A mark pattern(220) including information of the semiconductor chip is formed in the protective member. A rewiring electrically connects the semiconductor chip to each bonding pad. An insulation film covers the first surface, and has an opening which exposes a part of the rewiring. A connection member is electrically connected to the rewiring through the opening. The protective member includes a bonding layer in order to be attached on the second surface.
